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2024-03-21binman: etype: ti_secure_rom.py: remove unused fsstubDhruva Gole
fsstub seems to be unused and should be removed. Suggested-by: Neha Malcom Francis <n-francis@ti.com> Signed-off-by: Dhruva Gole <d-gole@ti.com> Reviewed-by: Neha Malcom Francis <n-francis@ti.com>
2024-03-21arm: dts: k3-*: s/fsstub/tifsstub/Dhruva Gole
Replace all the fsstub occurences with tifsstub to avoid new terminology and resulting confusion. Suggested-by: Nishanth Menon <nm@ti.com> Signed-off-by: Dhruva Gole <d-gole@ti.com>
2024-03-21board: ti: am64: Support TMDS64EVMRoger Quadros
The TMDS64EVM [1] ships with AM64X SR2.0 HS-FS chip and a slightly different board name in the board information EEPROM header. Support this board. [1] https://www.ti.com/tool/TMDS64EVM Gets rid of below message at boot "Unidentified board claims AM64-EVM in eeprom header" Signed-off-by: Roger Quadros <rogerq@kernel.org> Reviewed-by: Neha Malcom Francis <n-francis@ti.com>
2024-03-21arm: dts: j7xx: Allow privID 0 to pass through background firewallsManorit Chawdhry
Firewalling IP has 3 permissions slots for slave and DRU firewalls. Each permission slot can be populated with different accesses to different privIDs. Configuring a background firewall with an allow all permission (0xc3ffff) in just one slot doesn't work as intendted as the other permission slots which are essentially 0x0000 act as a block all transaction for privID 0. Explicitly fill all the permission registers of background firewall regions to allow all transactions to go through including privID 0. Foreground firewalls are intendted to block privID 0 as well so they are not touched. [ AM68-SK CSI Test ] Tested-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2024-03-21env: ti: ti_armv7_common: Run main_cpsw0_qsgmii_phyinit conditionallyManorit Chawdhry
commit 0d72b0f2f83b788273c40ed4a64d1adf74877726 upstream. Since upstream U-Boot uses ti_common.env instead of ti_armv7_common.env, the implementation here differs in this aspect from the upstream commit. The main_cpsw0_qsgmii_phyinit command is defined only for certain TI SoCs which have the do_main_cpsw0_qsgmii_phyinit variable set. Add a check to ensure that the main_cpsw0_qsgmii_phyinit command is run only for such SoCs. Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com> Signed-off-by: Siddharth Vadapalli <s-vadapalli@ti.com> Reviewed-by: Tom Rini <trini@konsulko.com> Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
2024-03-21arch: mach-k3: Fix incorrect mapping of higher DDR addresses as device memorySekhar Nori
Entry for physical address 0x500000000 in memory map table for MMU configuration is spilling over and inadvertently making DDR available at higher address (above 4GB address space) get mapped as device memory (nGnRnE). Fix this by adjusting entry size. Tested on AM62A SK. Before this patch: => time crc32 0x881000000 0x20000000 crc32 for 881000000 ... 8a0ffffff ==> 7f34d7ca time: 1 minutes, 14.716 seconds After patch: => time crc32 0x881000000 0x20000000 crc32 for 881000000 ... 8a0ffffff ==> 7f34d7ca time: 2.710 seconds Acked-by: Andrew Davis <afd@ti.com> Signed-off-by: Sekhar Nori <nsekhar@ti.com> Tested-by: Andreas Dannenberg <dannenberg@ti.com>
2024-03-21arm: dts: k3-j784s4-main: Add Itap Delay Value For DDR50 speed modeBhavya Kapoor
DDR50 speed mode is enabled for MMCSD in J784s4 but its Itap Delay Value is not present in the device tree. Thus, add Itap Delay Value for MMCSD Ultra High Speed DDR which is DDR50 speed mode for J784s4 SoC according to datasheet for J784s4 [1]. [1] Refer to : section 6.10.5.17.2 MMC1/2 - SD/SDIO Interface, in J784s4 datasheet - https://www.ti.com/lit/ds/symlink/tda4vh-q1.pdf Signed-off-by: Bhavya Kapoor <b-kapoor@ti.com> Reviewed-by: Neha Malcom Francis <n-francis@ti.com>
2024-03-21arm: dts: k3-j721s2-main: Add Itap Delay Value For DDR50 speed modeBhavya Kapoor
DDR50 speed mode is enabled for MMCSD in J721s2 but its Itap Delay Value is not present in the device tree. Thus, add Itap Delay Value for MMCSD Ultra High Speed DDR which is DDR50 speed mode for J721s2 SoC according to datasheet for J721s2 [1]. [1] Refer to : section 7.10.5.17.2 MMC1/2 - SD/SDIO Interface, in J721s2 datasheet - https://www.ti.com/lit/ds/symlink/tda4vl-q1.pdf Signed-off-by: Bhavya Kapoor <b-kapoor@ti.com> Reviewed-by: Neha Malcom Francis <n-francis@ti.com>
2024-03-21arm: dts: k3-j7200-main: Add Itap Delay Value For DDR52 speed modeBhavya Kapoor
DDR52 speed mode is enabled for eMMC in J7200 but its Itap Delay Value is not present in the device tree. Thus, add Itap Delay Value for eMMC High Speed DDR which is DDR52 speed mode for J7200 SoC according to datasheet for J7200 [1]. [1] Refer to : section 7.9.5.16.1 MMCSD0 - eMMC Interface, in J7200 datasheet - https://www.ti.com/lit/ds/symlink/dra821u-q1.pdf Signed-off-by: Bhavya Kapoor <b-kapoor@ti.com> Reviewed-by: Neha Malcom Francis <n-francis@ti.com>
2024-03-21configs: am64x_evm_r5_defconfig: Enable I2C GPIO driversRoger Quadros
We need the I2C GPIO drivers to detect expansion cards. Gets rid of below error message at R5 SPL on AM64-EVM "Failed to lookup gpio gpio@38_0: -22" Signed-off-by: Roger Quadros <rogerq@kernel.org>
2024-03-21arm: dts: k3-am642: Fix boot on SK-AM64BRoger Quadros
SK-AM64B boot is broken. The main_i2c0 node is left disabled in r5-evm.dts preventing proper board detection. Explicitly enable the main_i2c0 node in r5-evm.dts. Fixes boot and below error message: "Reading on-board EEPROM at 0x51 failed -19" Fixes: cc471479d3850: ("arm: dts: k3-am642: main_i2c0 cleanup") Reported-by: Andreas Dannenberg <dannenberg@ti.com> Suggested-by: Vignesh Raghavendra <vigneshr@ti.com> Signed-off-by: Roger Quadros <rogerq@kernel.org>
2024-03-21configs: j7200_evm_r5_defconfig: Define K3_OPP_LOWReid Tonking
Adds the default config for K3_OPP_LOW in J7200 Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21arm: mach-k3: J7200: Add support for OPP_LOWReid Tonking
Adds a check for K3_OPP_LOW config and will change MPU freq/voltage and msmc clock according to opp_low spec. Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21misc: k3_avs: add k3_check_opp functionReid Tonking
Useful when trying to check if an opp efuse is burned in or not. k3_avs driver checks opp_ids when probing and overwrites the voltage values in vd_data for the respective board. This can be called to check that data and returns 0 if valid. Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21misc: k3_avs: Change j7200 vtm compatible to align with upstreamReid Tonking
Upstream u-boot changed to using the ti,j7200-vtm compatible with the Linux 6.6 DT sync, so using the same here Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21misc: k3_avs: Add new opp_low to vd_dataReid Tonking
Add opp_low to j721e vd_data Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21misc: k3_avs: Add opp_low supportReid Tonking
J7200 has support for opp_low, so adding the option here Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21arm: dts: k3-j7200-r5-common: Reduce min voltage on avs regulator nodeReid Tonking
The J7200 SoC supports MPU core voltage of 760mv Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21arm: dts: k3-j7200-r5-common: Add msmc clk to a72 nodeReid Tonking
Define the MSMC clk in the a72 node Reviewed-by: Udit Kumar <u-kumar1@ti.com> Signed-off-by: Reid Tonking <reidt@ti.com>
2024-03-21doc: board: ti: k3: Mention TI_DM argumentNeha Malcom Francis
commit 09a17b0d01dd7c81f6fd96228581d7df47a1a7b1 upstream Mention TI_DM argument can be used to fetch a custom DM binary in the A72 build instructions for K3 devices. Signed-off-by: Neha Malcom Francis <n-francis@ti.com> Reviewed-by: Andrew Davis <afd@ti.com>
2024-03-21arm: dts: k3-*-binman: Move to using ti-dm entry typeNeha Malcom Francis
commit 3ef977e085767df31e42262f15837a66558052db upstream Move the DM entry in tispl.bin FIT image from default fetching an external blob entry to fetching using ti-dm entry type. This way, the DM entry will be populated by the TI_DM pathname if provided. Else it will resort to the ti-dm.bin file. Signed-off-by: Neha Malcom Francis <n-francis@ti.com> Reviewed-by: Andrew Davis <afd@ti.com>
2024-03-21binman: etype: dm: Add entry type for TI DMNeha Malcom Francis
commit 23d2ef91efa40d525a4a5557704184bcfd64ca16 upstream K3 devices introduces the concept of centralized power, resource and security management to System Firmware. This is to overcome challenges by the traditional approach that implements system control functions on each of the processing units. The software interface for System Firmware is split into TIFS and DM. DM (Device Manager) is responsible for resource and power management from secure and non-secure hosts. This additional binary is necessary for specific platforms' ROM boot images and is to be packaged into tispl.bin Add an entry for DM. The entry can be used for the packaging of tispl.bin by binman along with ATF and TEE. Signed-off-by: Neha Malcom Francis <n-francis@ti.com> Reviewed-by: Andrew Davis <afd@ti.com>
2024-03-21arch: arm: mach-k3: Update ARM64 MMU entries for J722SVaishnav Achath
Update ARM64 MMU entries for J722S to support early remoteproc boot requirements. Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21arm: dts: k3-j722s-evm: Sync with Linux CPSW3G DTSiddharth Vadapalli
Sync with Linux device-tree w.r.t. CPSW3G. With this, MAC Port 1 of the CPSW3G instance of CPSW Ethernet Switch is functional in RGMII-RXID mode of operation. Signed-off-by: Siddharth Vadapalli <s-vadapalli@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21configs: introduce configs needed for the J722SJayesh Choudhary
Introduce the initial configs needed to support the J722S SoC family. Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21arm: dts: Introduce J722S uboot dts filesJayesh Choudhary
Include the uboot device tree files needed to boot the board. Co-developed-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21arm: dts: Add J722S Device Tree from LinuxJayesh Choudhary
Pull in the device tree source files for TI's J722S SoCs needed to boot the board from v6.6-rc5. These are an early release with only the peripherals to boot the board via UART boot. Co-developed-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21dma: ti: k3-udma: Add DMA PSIL mappings for CSI for J722SJayesh Choudhary
PSIL mapping is same as AM62P other than extra instances of CSI-RX. Reuse the same file and add CSI PSIL mapping there. Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21board: ti: Introduce basic board files for the J722S familyJayesh Choudhary
Introduce the basic files needed to support the TI J722S family of SoCs. Co-developed-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21firmware: ti_sci_static_data: Add static DMA channelJayesh Choudhary
Include the static DMA channel data for using DMA at SPL stage for J722S SoC family. Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21arch: mach-k3: Introduce basic files to support J722S SoC familyJayesh Choudhary
Introduce the basic functions and definitions needed to properly initialize TI J722S family of SoCs. Co-developed-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21ram: k3-ddrss: Enable the am62ax's DDR controller for J722SJayesh Choudhary
The J722S family of SoCs uses the same DDR controller as found on the AM62A family. Enable this option when building for the J722S family. Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com> Reviewed-by: Neha Malcom Francis <n-francis@ti.com>
2024-03-21arm: mach-k3: j722s: introduce clock and device files for J722S SoCJayesh Choudhary
Introduce support for J722S SoC. Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21soc: add info to identify the J722S SoC familyJayesh Choudhary
Include the part number for TI's j722s family of SoC to identify it during boot. Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com> Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
2024-03-21board: ti: j721e: Prefix BBAI64 DTB name with directoryPrasanth Babu Mantena
Update variable name_fdt for beagleboneai64 case with vendor prefix to locate the dtb files. This prefix of vendor specific directory is made to avoid naming issues and match the path on the latest kernel versions. Signed-off-by: Prasanth Babu Mantena <p-mantena@ti.com> Reviewed-by: Neha Malcom Francis <n-francis@ti.com>
2024-03-21mtd: rawnand: omap_elm: Fix elm_init definitionRoger Quadros
The macro ELM_BASE is defined in mach/hardware.h and is not visible at the omap_elm.h header file. Avoid using it in omap_elm.h. Reported-by: Hong Guan <hguan@ti.com> Fixes: 7363cf0581a3 ("mtd: rawnand: omap_elm: u-boot driver model support") Signed-off-by: Roger Quadros <rogerq@kernel.org>
2024-03-20board: toradex: verdin-am62_r5: Increase SPL_STACK_R_MALLOC_SIMPLE_LENHiago De Franco
Increase the SPL_STACK_R_MALLOC_SIMPLE_LEN to 0x200000 to accommodate the size of tispl.bin fit image. With the recent upgrade of ti-linux-firmware from version v9.1.0 to v9.2.5, the size of tispl.bin fit image has increased to 1.4MB, causing allocation errors in the R5 SPL: ``` alloc space exhausted Could not get FIT buffer of 1325056 bytes check CONFIG_SPL_SYS_MALLOC_SIZE ``` Upstream-Status: Submitted [https://lore.kernel.org/all/20240320164845.141894-1-hiagofranco@gmail.com/] - Only the verdin-am62_r5_defconfig was submmited because USB support is missing upstream, and there is no verdin-am62_r5_usbdfu_defconfig file yet. Related-to: ELB-5658 Signed-off-by: Hiago De Franco <hiago.franco@toradex.com>
2024-03-19arm: dts: k3-am625-verdin-r5: Change CPU frequency to 800MHzJoao Paulo Goncalves
The lowest speed grade of Toradex AM62 SoMs is K speed, resulting in a max value of 800MHz for the CPU operating frequency. A solution with runtime selection of the CPU frequency is already planned to avoid these kinds of problems in the future. Upstream-Status: Submitted [https://lore.kernel.org/u-boot/20240319140427.73721-1-jpaulo.silvagoncalves@gmail.com/T/#u] Fixes: 8fb8a6d49977 ("arm: dts: k3-am625-verdin-r5:Change CPU frequency to 1000MHz") Signed-off-by: Joao Paulo Goncalves <joao.goncalves@toradex.com>
2024-02-19arm: dts: k3-am625-verdin-r5: Change CPU frequency to 1000MHzVitor Soares
The same U-Boot binary is compatible with multiple Verdin AM62 board variants. However, some of the SoC models can only operate at a maximum speed of 1 GHz. Previously, the boards with lower-speed grades were running at overclocked speeds, leading to kernel complaints about unsupported configurations. To resolve this issue, the operating speed has been decreased to the maximum allowable value across all Verdin AM62 board variants. As a result, there is a regression in overall boot time, increasing by around 200 milliseconds for the faster SoC variant. Upstream-Status: Submitted [https://lore.kernel.org/all/20240219123408.22054-1-ivitro@gmail.com] Related-to: ELB-5325 Signed-off-by: Vitor Soares <vitor.soares@toradex.com>
2024-02-14Revert "board: verdin-am62: set cpu core voltage depending on speed grade"Francesco Dolcini
This reverts commit d2099587d661c6ca2309256c0e04c06e26c8d34c. According to TI changing the VDD_CORE while the SoC is running is not allowed, the voltage must be set before the AM62 device reset is released, revert this change therefore. The correct solution would be to program the PMIC during manufactoring according to the speed grade of the SoC. Upstream-Status: Backport [ea7d3eec1e6e6541db68bf48a1314410e06cd9de] Link: https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1318338/am623-booting-from-mmc-failed-after-lowering-vdd_core-to-0-75v/5036508#5036508 Fixes: d2099587d661 ("board: verdin-am62: set cpu core voltage depending on speed grade") Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
2024-02-08arm: mach-k3: am62: Fixup thermal zone critical pointsJoao Paulo Goncalves
Read the max temperature for the SoC temperature grade from the hardware and change the critical trip nodes on each thermal zone of FDT at runtime so they are correct with the hardware value for its grade. Upstream-Status: Submitted [https://lore.kernel.org/all/20240208092951.11769-1-francesco@dolcini.it/#t] Signed-off-by: Joao Paulo Goncalves <joao.goncalves@toradex.com> Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
2024-02-08arm: mach-k3: am62: Get soc max temperature by gradeJoao Paulo Goncalves
AM62x SoC is available in multiple temperature grade: - Commercial: 0° to 95° C - Industrial: -40° to 105° C - Automotive: -40° to 125° C Add a new function that returns the am62 max temperature value accordingly to its temperature grade in Celsius. Upstream-Status: Submitted [https://lore.kernel.org/all/20240208092951.11769-1-francesco@dolcini.it/#t] Signed-off-by: Joao Paulo Goncalves <joao.goncalves@toradex.com> Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
2024-01-18board: verdin-am62: set cpu core voltage depending on speed gradeMax Krummenacher
Speed grade T requires the VDD_CORE voltage to be 0.85V if using the maximum core frequency. Speed grades G, K, S allow the VDD_CORE voltage to be 0.75V up to the maximum core frequency but allow to run at 0.85V. For efficiency in manufacturing and code maintenance we use 0.85V for the PMIC defaults and device tree settings and dynamically adjust the voltage in the PMIC and device tree to 0.75V for lower speed SKU to gain more than 100mW power consumption reduction. Upstream-Status: Submitted [https://lore.kernel.org/all/20240117101743.3955852-1-max.oss.09@gmail.com/T/#t] Signed-off-by: Max Krummenacher <max.krummenacher@toradex.com>
2024-01-18arm: mach-k3: am62: provide more soc feature info accessorsMax Krummenacher
Add two functions, one which returns the SoC speed grade and one which returns the SoC operating temperature range. Upstream-Status: Submitted [https://lore.kernel.org/all/20240117101743.3955852-1-max.oss.09@gmail.com/T/#t] Signed-off-by: Max Krummenacher <max.krummenacher@toradex.com>
2024-01-18arm: mach-k3: am62: move device identification accessor functions to headerMax Krummenacher
mach-k3/am625_fdt.c does fdt fixup depending on fields in the device identification register. Move the accessors to the device identification register as inline functions into the am62_hardware.h header, so that they can be used for other functionality. Upstream-Status: Submitted [https://lore.kernel.org/all/20240117101743.3955852-1-max.oss.09@gmail.com/T/#t] Signed-off-by: Max Krummenacher <max.krummenacher@toradex.com>
2024-01-18board: verdin-am62: improve comment on usb phy core voltageMax Krummenacher
TI recommends to clear the bit independent of the used voltage. So the comment which claims to do it due to the core voltage at 0.85V is bogus. See https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1252724/am625-usb-phy-core-voltage-selection-and-vdda_core_usb-mismatch Upstream-Status: Submitted [https://lore.kernel.org/all/20240117101743.3955852-1-max.oss.09@gmail.com/T/#t] Signed-off-by: Max Krummenacher <max.krummenacher@toradex.com>
2024-01-18headers: don't depend on errno.h being availableMax Krummenacher
These headers follow the pattern: | #if CONFIG_IS_ENABLED(FANCY_FEATURE) | void foo(void); | #else | static inline void foo(void) { return -ENOSYS; } | #endif In the #else path ENOSYS is used, however linux/errno.h is not included. If errno.h has not been included already the compiler errors out even if the inline function is not referenced. Make those headers self contained. Upstream-Status: Submitted [https://lore.kernel.org/all/20240118181106.4133924-1-max.oss.09@gmail.com/T/#u] Signed-off-by: Max Krummenacher <max.krummenacher@toradex.com>
2024-01-11arm: dts: k3-am625-verdin: binman: add fsstub to tispl.binParth Pancholi
Adds fsstub binaries to tispl binary, this is required for deepsleep functionality. This implements the same change as commit 91886b68025c ("arm: dts: k3: binman: am625: add support for signing FSSTUB images") did for TI AM62 SK board. Upstream-Status: Pending Signed-off-by: Parth Pancholi <parth.pancholi@toradex.com>
2023-12-19arm: dts: k3-am625-verdin: fix DDRSS configurationEmanuele Ghidoli
The current DDR subsystem configuration occasionally results in write failures, impacting memory stability, on Verdin AM62 Solo 512MB WB IT 0072 SKU. This commit addresses the issue by adjusting Drive Pull-Up/Down and Write Latency to improve the eye diagram and ensure reliable write operations. This configuration is shared with all Verdin AM62 SoM and it does not introduce regressions. Configurations changes from previous / default values: - Drive Pull-Up/Down from 40 to 34.3 Ohm - Write Latency from 8 to 10 - ODTLon / ODTLoff latency from 0 / 0 to 4 / 20 nCK - VREF control range 1 at 27 % - tFAW from 30 to 40 ns Configuration is output from SysConfig [1] web tool, currently at version 1.18.1+3343 (DDR SubSystem v9.10). [1] https://dev.ti.com/sysconfig Upstream-Status: Submitted [https://lore.kernel.org/all/20231219082533.8399-1-francesco@dolcini.it/] Fixes: 7d1a10659f5b ("board: toradex: add verdin am62 support") Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com> Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
2023-12-11Merge tag '09.01.00.008' into toradex_ti-u-boot-2023.04-09.01.00.008Francesco Dolcini
RC Release 09.01.00.008