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authorStefan Agner <stefan.agner@toradex.com>2016-11-15 10:38:23 -0800
committerMarcel Ziswiler <marcel.ziswiler@toradex.com>2017-01-11 21:22:25 +0100
commita78ed5e22646ffb50cbf841a3f56bb48c5a50f62 (patch)
tree8bc4f8d02b22ebd9e3213b756d2ffa82d8bdd4bb /include/grlib
parent47f83a6b7d0b9351a031334428d67b5c05b63967 (diff)
arm: mx6: specify SPL padding
Specify standard padding for payload to 68KB. This is derived from the maximum header size plus maximum SPL size. It matches the already defined offset for SD/eMMC devices (69KB) too. This allows to use the u-boot-with-spl.imx build target to generate a directly flashable image which can be flashed using: dd if=u-boot-with-spl.imx of=/dev/mmcblk0 bs=512 skip=2 While the patch has been created with SD/eMMC in mind, this also works with other boot media. The board file needs to configure the media specific (absolute) payload offset accordingly. Especially the IVT offset is boot media specific and can be retrieved from the reference manual (Table 8-25. Image Vector Table Offset and Initial Load Region Size). For NAND boot a define like this should do the job: #define CONFIG_SYS_NAND_U_BOOT_OFFS (SPL_PAD_TO + 0x400) Signed-off-by: Stefan Agner <stefan.agner@toradex.com> (cherry picked from commit 0405092bd21a44f5af22f17aeb0b82a0a11e1252)
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