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authorIngo Molnar <mingo@elte.hu>2011-12-20 20:32:03 +0100
committerIngo Molnar <mingo@elte.hu>2011-12-20 20:32:11 +0100
commitd87f69a16eb2cb96459117b06949a560679002e4 (patch)
treebbb55b2bd2b6c9e8bd4067aa3279783cb6bd9028 /Documentation/devicetree/bindings/vendor-prefixes.txt
parent124ba9403318d834ef21bcd899c22c870708d2c4 (diff)
parent384703b8e6cd4c8ef08512e596024e028c91c339 (diff)
Merge commit 'v3.2-rc6' into perf/core
Merge reason: Update with the latest fixes. Signed-off-by: Ingo Molnar <mingo@elte.hu>
Diffstat (limited to 'Documentation/devicetree/bindings/vendor-prefixes.txt')
-rw-r--r--Documentation/devicetree/bindings/vendor-prefixes.txt1
1 files changed, 1 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
index e8552782b440..874921e97802 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.txt
+++ b/Documentation/devicetree/bindings/vendor-prefixes.txt
@@ -33,6 +33,7 @@ qcom Qualcomm, Inc.
ramtron Ramtron International
samsung Samsung Semiconductor
schindler Schindler
+sil Silicon Image
simtek
sirf SiRF Technology, Inc.
stericsson ST-Ericsson